PROCESS FOR PASSIVATING ANODIZATION OF COPPER IN A MOLTEN FLUORIDE MEDIUM, AND APPLICATION TO THE PROTECTION OF COPPER PARTS OF FLUORINE ELECTROLYZERS
作者： Lamirault Sylvie , Germanaz Patrick , Picard Gerard
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摘要: Abstract not available for EP0321536Abstract of corresponding document: US4892630PCT No. PCT/FR88/00334 Sec. 371 Date Feb. 23, 1989 102(e) PCT Filed Jun. 1988 Pub. WO88/10328 Dec. 29, 1988.A process producing a strong, adherent protective layer on copper parts, with high rate covering the substrate, by passivating anodization, characterized in that parts are immersed liquid KF, 2HF bath and subjected to anodic current low surface-related density which is less than 0.1 A/dm2, may be continuous or intermittent.
lens.org 参考文章(1)
K.D. Beccu, H. Giess, A. Porta, An inorganic coating process providing copper with an electrically insulating layer by anodisation in non-aqueous fluoride electrolytes Electrodeposition and Surface Treatment. ,vol. 1, pp. 253- 265 ,(1973) , 10.1016/0300-9416(73)90018-7