摘要: Induced codeposition of tungsten with nickel from aqueous solutions sodium tungstate was studied. Ammonia is commonly added to such plating baths adjust the pH, but its role as a ligand for complexes usually ignored. Removing ammonia helped increase content alloy 50 atom % (76 wt %). First indications formation an amorphou s Ni/W at intermediate concentrations (20-40 %) were observed. It shown that reported effect tem perature on composition due removal solution. In absence, plated given solution essentially independent temperature. © 2000 The Electrochemical Society. S1099-0062(00)07-098-X. All rights reserved.
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