Package for storing semiconductor element and method for manufacturing the same

摘要: PROBLEM TO BE SOLVED: To provide a method for manufacturing package in which, when an external connection terminal of bonded body after the completion forming step is disposed vertically upper direction, convex warpage longitudinal direction heat sink material toward lower side corrected to concave side.SOLUTION: A storing semiconductor element including metal 3 having rectangular shape, ring-shaped ceramic frame 4 on surface via wax material, and 5 comprises: 2 (a first step); bonding fixture using thermoplastic resin while keeping curved second polishing onto third removing from fourth step).