Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing
作者： C.C. Li , F. Drymiotis , L.L. Liao , M.J. Dai , C.K. Liu
DOI: 10.1016/J.ENCONMAN.2015.03.089
关键词:
摘要: We use the rapid hot-pressing method to bond Ag foil onto pure PbTe in order assess its effectiveness as a bonding layer material for thermoelectric module applications. Scanning electron microscopy and X-ray diffraction are employed examine intermetallic compound formation microstructure evolution during isothermal aging at 400 °C 550 °C. find that is promising modules operating T_(Hot) ⩽ Additionally, our approach highlights highly effective inexpensive metallize prior assembly.
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