Process for forming multi-layer electronic structures
作者： James Steven Kamperman , David Brian Stone , Thomas Patrick Gall
DOI:
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摘要: A process of forming a multi-layer electronic composite structure. The includes providing at least one core including plane electrically conducting material with insulating on both sides the material. plurality placed through holes formed therethrough. At pad is provided over plated holes. provides flat surface for attaching an device and also prevents solder from entering hole.
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