作者: Gordon Chiang Ma
DOI:
关键词:
摘要: An unpacked structure for a power device of radio frequency amplification module and assembly method therefor. The includes the device, heat dissipating plate printed circuit board, wherein is embedded into board; arranged below carrier flange, plurality electronic elements lead wires; are directly welded on flange according to design requirement; board fixed plate; connected with one another through wires wires.