A Class of Ceramic-Based Chip Inductors for Hybrid Integration in Power Supplies

作者: Michele H Lim , Jacobus D van Wyk , Fred C Lee , Khai DT Ngo , None

DOI: 10.1109/TPEL.2008.921180

关键词:

摘要: A review of some the available technologies for inductor hybrid integration is given in this paper. In accordance with low voltage and high current requirements, low-temperature co-fired ceramics (LTCC) technology identified to be a suitable candidate power electronics passives integration. This paper will discuss various limitations LTCC processing technique introduce fabrication which open new field chip inductors The design an also presented. exhibits inherent dependent inductance, leading efficiency at loads as important systems advantage portable electronics.

参考文章(44)
H. Ohashi, Power electronics innovation with next generation advanced power devices international telecommunications energy conference. pp. 9- 13 ,(2003)
D. Boroyevich, Z. Liang, F.C. Lee, J.D. van Wyk, An integrated power switching stage with multichip planar interconnection construction international power electronics and motion control conference. ,vol. 1, pp. 364- 369 ,(2004)
H. Khatri, L.E. Larson, D.Y.C. Lie, On-chip monolithic filters for receiver interference suppression using bond-wire inductors topical meeting on silicon monolithic integrated circuits in rf systems. pp. 166- 169 ,(2006) , 10.1109/SMIC.2005.1587934
S. Dalmia, J.M. Hobbs, V. Sundaram, M. Swaminathan, Seock Hee Lee, F. Ayazi, G. White, S. Bhattacharya, Design and optimization of high Q RF passives on SOP-based organic substrates electronic components and technology conference. pp. 495- 503 ,(2002) , 10.1109/ECTC.2002.1008142
Michele Lim, J. Van Wyk, Zhenxian Liang, Effect of geometry variation of LTCC distributed air-gap filter inductor on light load efficiency of DC-DC converters ieee industry applications society annual meeting. ,vol. 4, pp. 1884- 1890 ,(2006) , 10.1109/IAS.2006.256793
C.Q. Scrantom, J.C. Lawson, LTCC technology: where we are and where we're going. II 1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390). pp. 193- 200 ,(1999) , 10.1109/MTTTWA.1999.755161
X. Sun, D. Linten, O. Dupuis, G. Carchon, P. Soussan, S. Decoutere, W. De Raedt, High-Q on-chip inductors using thin-film wafer level packaging technology demonstrated on a 90 nm RF-CMOS 5 GHz VCO european microwave conference. ,vol. 1, ,(2005) , 10.1109/EUMC.2005.1608797
H. Tsujimoto, O. Ieyasu, High frequency transmission characteristic of co-planar film transformer fabricated on flexible polyamide film IEEE Transactions on Magnetics. ,vol. 31, pp. 4232- 4234 ,(1995) , 10.1109/20.489936
M. Mino, T. Yachi, A. Tago, K. Yanagisawa, K. Sakakibara, Planar microtransformer with monolithically-integrated rectifier diodes for micro-switching converters IEEE Transactions on Magnetics. ,vol. 32, pp. 291- 296 ,(1996) , 10.1109/20.486336