Circuit housing clamp and method of manufacture therefor
作者： Farzaneh Yahyaei-Moayyed , Glenn E. Stewart , Geoffery L. Reid , Kristopher Frutschy
DOI:
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摘要: An electronic assembly includes one or more conductive clamps (302, 304, FIG. 3), which are used to supply current an integrated circuit (IC) package (308). The attached a printed (PC) board (312), supplies the IC over clamp, and receives returned from another clamp. Each clamp contacts contact pad (330) on surface of PC board, (334) top package. Vias (338, 339) planes (340, 342) within then carry (e.g., 306) connected In embodiment, (904, 9) holds structure (902) in place between (908) (914), is carried primarily structure, rather than
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