作者: Mindaugas Fernand Dautartas , John William Osenbach , Robert Benedict Comizzoli
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摘要: The specification describes a process for passivating semiconductor laser structures with severe steps in the surface topography. technique involves atomic layer deposition to produce which has exceptional coverage and uniformity, even case of trench features aspect ratios as large 5. In addition, passivation produced by this excellent environmental stability, affords protection against air born contaminant induced degradation.