Vertical bipolar read access for low voltage memory cell

作者: Leonard Forbes

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摘要: A memory device is described which has an n-channel FET access transistor coupled between a cell and data communication line. An NPN bipolar also the line in parallel to transistor. base connection of as body control threshold voltage variations During operation used for writing cell, while read operations conjunction with current sense amplifier circuit. The transistors are fabricated single vertical pillar.

参考文章(203)
Y. Ohno, T. Kishimoto, K. Sonoda, H. Sayama, S. Komori, A. Kinomura, Y. Horino, K. Fujii, T. Nishimura, N. Kotani, M. Takai, H. Miyoshi, Estimation of the Charge Collection for the Soft-Error Immunity by the 3D-Device Simulation and the Quantitative Investigation Springer, Vienna. pp. 302- 305 ,(1995) , 10.1007/978-3-7091-6619-2_73
H. Watanabe, T. Tatsumi, A. Sakai, S. Shishiguchi, T. Niino, I. Honma, T. Mizutani, T. Kikkawa, Hemispherical Grained Silicon (HSG-Si) Formation on In-Situ Phosphorous Doped Amorphous-Si Using The Seeding Method The Japan Society of Applied Physics. ,(1992) , 10.7567/SSDM.1992.PD3-1
H. Watanabe, T. Tatsumi, T. Niino, A. Sakai, S. Adachi, N. Aoto, K. Koyama, T. Kikkawa, An Advanced Fabrication Technology of Hemispherical Grained (HSG) Poly-Si for High Capacitance Storage Electrodes The Japan Society of Applied Physics. ,(1991) , 10.7567/SSDM.1991.A-8-4
T. Yamada, S. Samata, H. Takato, Y. Matsushita, K. Hieda, A. Nitayama, F. Horiguchi, F. Masuoka, Spread source/drain (SSD) MOSFET using selective silicon growth for 64 Mbit DRAMs International Technical Digest on Electron Devices Meeting. pp. 35- 38 ,(1989) , 10.1109/IEDM.1989.74216
K. Sunouchi, H. Takato, N. Okabe, T. Yamada, T. Ozaki, S. Inoue, K. Hashimoto, K. Hieda, A. Nitayama, F. Horiguchi, F. Masuoka, A surrounding gate transistor (SGT) cell for 64/256 Mbit DRAMs International Technical Digest on Electron Devices Meeting. pp. 23- 26 ,(1989) , 10.1109/IEDM.1989.74220
H.K. Kang, K.H. Kim, Y.G. Shin, I.S. Park, K.M. Ko, C.G. Kim, K.Y. Oh, S.E. Kim, C.G. Hong, K.W. Kwon, J.Y. Yoo, Y.G. Kim, C.G. Lee, W.S. Paick, D.I. Suh, C.J. Park, S.I. Lee, S.T. Ahn, C.G. Hwang, M.Y. Lee, Highly manufacturable process technology for reliable 256 Mbit and 1 Gbit DRAMs international electron devices meeting. pp. 635- 638 ,(1994) , 10.1109/IEDM.1994.383330
K. Sunouchi, F. Horiguchi, A. Nitayama, K. Hieda, H. Takato, N. Okabe, T. Yamada, T. Ozaki, K. Hashimoto, S. Takedai, A. Yagishita, A. Kumagae, Y. Takahashi, F. Masuoka, Process integration for 64 M DRAM using an asymmetrical stacked trench capacitor (AST) cell international electron devices meeting. pp. 647- 650 ,(1990) , 10.1109/IEDM.1990.237116
T. Ozaki, A. Nitayama, K. Sunouchi, H. Takato, S. Takedai, A. Yagishita, K. Hieda, F. Horiguchi, A surrounding isolation-merged plate electrode (SIMPLE) cell with checkered layout for 256 Mbit DRAMs and beyond international electron devices meeting. pp. 469- 472 ,(1991) , 10.1109/IEDM.1991.235354
H. Takato, K. Sunouchi, N. Okabe, A. Nitayama, K. Hieda, F. Horiguchi, F. Masuoka, High performance CMOS surrounding gate transistor (SGT) for ultra high density LSIs international electron devices meeting. ,vol. 136, pp. 222- 225 ,(1988) , 10.1109/IEDM.1988.32796
D. Hisamoto, S. Kimura, T. Kaga, Y. Nakagome, M. Isoda, T. Nishida, E. Takeda, A new stacked cell structure for giga-bit DRAMs using vertical ultra-thin SOI (DELTA) MOSFETs international electron devices meeting. pp. 959- 961 ,(1991) , 10.1109/IEDM.1991.235266