Multi-dice chip scale semiconductor components and wafer level methods of fabrication

摘要: A semiconductor component includes a base die and secondary stacked on bonded to the die. The conductive vias which form an internal signal transmission system for component, allow circuit side of be back also array terminal contacts in electrical communication with vias. can include encapsulant die, substantially encapsulates polymer layer functions as protective layer, rigidifying member stencil forming contacts. method fabricating step bonding singulated dice wafer, or wafer dice.