Electrical and thermal conducting structure with resilient conducting paths

摘要: A conducting structure includes a dielectric matrix with first surface and second surface. At least one via extends from the of to matrix. In at conductive members are formed which include elements an optional binder. The have maximum dimension of: (i) about 5% length via, and, (ii) 10% width via. size, shape number in each as well composition binder, may be selected provide element controlled electrical and/or thermal conductivity, modulus, for particular application.