Under bump metallization
作者： Yuan-ko Hwang , Chih-Fei Lee , Fu-Cheng Chang , Hsin-Chi Chen , Chi-Cherng Jeng
DOI:
关键词:
摘要: A structure of an under bump metallization and a method forming the same are provided. The has redistribution via hole, viewed from top, in round shape or polygon having angle between adjacent edges greater than 90°. Therefore, step coverage later formed metal layer can be improved.
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