The fracture behavior of multiple cracks emanating from a circular hole in piezoelectric materials

作者: Jun-Hong Guo , Zi-Xing Lu , Xiang Feng

DOI: 10.1007/S00707-010-0327-4

关键词:

摘要: Using the complex variable method and a new conformal mapping, fracture behavior of multiple cracks emanating from circular hole in piezoelectric materials is considered under remotely uniform in-plane electric anti-plane mechanical loadings. The analytic solutions field intensity factors energy release rate are presented by taking effect dielectric permittivity into consideration. Known results can be derived as special cases general solutions. illustrated with plots, showing that material containing three radial spaced equally at 120° apart originating easiest to fail for all Moreover, if there exist (n ≥ 3) materials, an increase number enhance reliability these materials. star-shaped possess similar characteristics.

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