摘要: In a broad sense, metal polishing is an extremely ancient technology that has long been used to make beautiful objets d’art as well utilitarian objects. However, within the context of modern microelectronics it much more narrowly defined invariably fabricate “damascene” structures. The origin this terminology obscure, however for integrated circuit fabrication damascene means microscopic, inlaid features serve “wiring” connect individual electronic components, e.g., transistors, previously formed in underlying semiconductor substrate (usually single crystal silicon wafer). Of course, overall objective functional devices such microprocessors or memories. Naturally, purpose wiring must be some insulating material (typically silica based glass) with appropriate provision made interconnections between wires and themselves. Indeed, case complex sophisticated logic circuits, several layers both horizontally vertically interconnected structures fabricated form “multilayer interconnect” order accommodate required connections tens millions components.