Stress relaxation in nickel at 20–300°k
作者： P Feltham , G Lehmann , R Moisel
DOI: 10.1016/0001-6160(69)90146-1
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摘要: Abstract Logarithmic stress relaxation was studied in 99.999% polycrystalline nickel at natural strains of up to 25% 20, 77, 200 and 293°K. The activation energy 1,4 ± 0.2 eV associated with the process suggests that vacancy formation by jogged dislocations is rate determining. At room temperature significant loss or immobilisation during appears be facilitated crossslip.
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