Copper interconnection structure incorporating a metal seed layer
作者： Chao-Kun Hu , Andrew H. Simon , James Mckell Edwin Harper , Cyprian Emeka Uzoh , Daniel Charles Edelstein
DOI:
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摘要: The present invention discloses an interconnection structure for providing electrical communication with electronic device which includes a body that is formed substantially of copper and seed layer either alloy or metal does not contain sandwiched between the conductor improving electromigration resistance, adhesion property other surface properties structure. also discloses, methods forming connections to by first depositing on device, then intimately bonding such are improved.
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