Semiconductor component and method of fabricating semiconductor component
作者： Atsushi Nakamura , Masami Ikegami
DOI:
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摘要: There is provided a semiconductor component including: substrate of first conduction type; layer second type that formed on the and PN-joined with substrate; an insulator laminated layer; metal at pre-specified region; side which insulating laminated, being directly under such incident light from not illuminated onto layer, containing more impurities than portion conducts between semiconductor.
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