作者: Michael D. Delmore , Tracie J. Berniard , Mark D. Weigel , Samuel Kidane , Mark A. Roehrig
DOI:
关键词:
摘要: The present application is directed to an assembly comprising electronic device, and a multilayer film. film comprises barrier stack adjacent the device; weatherable sheet opposite device. additionally protective layer in contact with device sheet. allows for combination of any disclosed elements.