Wire saw and process for slicing multiple semiconductor ingots

摘要: A wire saw (10) for simultaneously slicing multiple, generally cylindrical monocrystalline ingots (14) into wafers. The includes a cutting head (16), an ingot support (12), and multiple parallel lengths of (18) defining web (30). (12) is adapted mounting at least two thereon in registration with the web. slurry delivery system nozzles (34, 36, 38) amount one more than number ingots, being positioned dispensing along lateral sides each ingot. process semiconductor wafers to common support, moving relative so that press against regions, liquid three locations on including outermost regions location between pair ingots.