作者: Tsuneo Aoi , 恒夫 青井 , Masakazu Mesaki , 正和 目崎 , Masaru Fujiwara
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摘要: PROBLEM TO BE SOLVED: To provide an insulating wire in which thick-filming of enamel layer can be realized without reducing adhesion strength the conductor and layer. SOLUTION: This is comprises at least one enamel-baked on outer periphery a extrusion coating resin outside it total thickness 60 μm or more. Then, this wire, made 50 less. Furthermore, material has tensile modulus elasticity 1,000 MPa more 25°C 10 250°C. COPYRIGHT: (C)2005,JPO&NCIPI