Modelling of Interconnects by Boundary Element Method
作者： W. Wlodarczyk
DOI: 10.1007/978-3-642-45678-7_14
关键词:
摘要: Scaling down of chip-to-chip interconnections to finer geometries can limit the overall performance a digital system and therefore better characterization its electrical parameters is demanded. In order extract equivalent circuit interconnect structures, related 2-D electromagnetic field problems are solved by use boundary element method (BEM). Special attention paid frequency dependent conductor losses due skin effect.
springer.com
springerlink.com参考文章(8)
Carlos Alberto Brebbia, The Boundary Element Method for Engineers ,(1978)
J.E. Schutt-Aine, R. Mittra, Scattering parameter transient analysis of transmission lines loaded with nonlinear terminations IEEE Transactions on Microwave Theory and Techniques. ,vol. 36, pp. 529- 536 ,(1988) , 10.1109/22.3545
P. Waldow, I. Wolff, The Skin-Effect at High Frequencies IEEE Transactions on Microwave Theory and Techniques. ,vol. 33, pp. 1076- 1082 ,(1985) , 10.1109/TMTT.1985.1133172
G.I. Costache, Finite Element Method Applied to Skin-Effect Problems in Strip Transmission Lines IEEE Transactions on Microwave Theory and Techniques. ,vol. 35, pp. 1009- 1013 ,(1987) , 10.1109/TMTT.1987.1133799
W.H. Chang, Correction to "Analytical IC Metal-Line Capacitance Formulas" (Letters) IEEE Transactions on Microwave Theory and Techniques. ,vol. 25, pp. 712- 712 ,(1977) , 10.1109/TMTT.1977.1129193
H.A. Wheeler, Formulas for the Skin Effect Proceedings of the IRE. ,vol. 30, pp. 412- 424 ,(1942) , 10.1109/JRPROC.1942.232015
Oh-Kyong Kwon, R. Pease, Closely Packed Microstrip Lines as Very High Speed Chip-to-Chip Interconnects IEEE Transactions on Components, Hybrids, and Manufacturing Technology. ,vol. 10, pp. 314- 320 ,(1987) , 10.1109/TCHMT.1987.1134766
U. Ghoshal, L.N. Smith, Finite element analysis of skin effect in copper interconnects at 77 K and 300 K international microwave symposium. pp. 773- 776 ,(1988) , 10.1109/MWSYM.1988.22146