Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

摘要: The purpose of this paper is to investigate the effect different viscosity models (Cross and Al-Ma’aiteh) printing speeds on numerical results (e.g. pressure over stencil) a model regarding stencil printing.,A finite volume was established for describing process. Two types non-Newtonian fluid properties were compared. Cross fitted measurement in initial state lead-free solder paste, parameters Al-Ma’aiteh material stabilised same paste. Four also investigated from 20 200 mm/s.,Noteworthy differences found between utilising model. difference reached 33-34% both 70 mm/s 31% 27% speed 120 200 mm/s. variation explained by increase rates shear increasing speeds.,Parameters should be determined Neglecting thixotropic paste nature modelling can cause calculation error even approximately 30%. By using pastes provide more accurate printing, which necessary effective optimisation process, eliminating soldering failures highly integrated electronic devices.