Changing printing control parameters based on measured solder paste deposits in certain subareas of a printed circuit board
作者： Robert Gray , Matthew Greer
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摘要: It is described a method for changing parameters controlling transfer of solder paste onto printed circuit board (150, 250). The comprises (a) identifying first subareas (256, 258) the 250), which exhibit repeatability with respect to amount being supposed be transferred (b) second (252, 254) wherein smaller than repeatability, (c) transferring 250) at least (d) measuring has been 254), and (e) in response measured 254). further corresponding processing device, system comprising such device computer program and/or carrying out method.
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