Analysis on Bi2Te3 thermoelectric cooler with silica aerogel encapsulation
作者： H.M. Hu , T.S. Ge , Y.J. Dai , R.Z. Wang
DOI: 10.1016/J.ENCONMAN.2015.07.015
关键词:
摘要: Abstract A Bi 2 Te 3 TEC with silica aerogel encapsulation is developed. Silica different thicknesses filled in the void spaces around TE legs and started from cold-side ceramic plate. three dimensional mathematical model for This considers effect air gap aerogel. (Bi 0.2 Sb 0.8 ) (Te 0.97 0.03 , which have temperature-dependent properties, are selected to be p-type n-type materials. Also, an experimental test bench built validate model. The performances of non-silica encapsulated without consideration investigated. Meanwhile, effects under T a s V analysed. results show that cold side interconnector, part can insulated effectively while hot dissipated using when h ⩾ c . maximum Q at L aer = 0.8 mm nearly increased by 7% as compared = 0 mm = ( + )/2. Moreover, apart should about 2%, 15% 25% leg corresponding condition = )/2 = respectively. value ( − )/( optimum COP condition.
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