Efficient heat transfer from conduction-cooled circuit cards
作者： Charles H. Dando , Clint Long , Randall J. Stutzman
DOI:
关键词:
摘要: A conduction-cooled card assembly (100) is disclosed that includes a conduction-cooling frame (102), printed wiring board (104) mounted on the frame, and wedgelock fastener (122). The conduction- cooling has thermal management interface (124) adapted to transfer heat from chassis (128), press of against rail chassis.. also one or more following characteristics: (a) made primarily first material portion engage second softer than material, (b) another material. for assemblies which comprises housing at least rails within are receive therebetween. At surface
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