Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

摘要: Thermal conductivity is one of the key parameters required for high-temperature structural applications metallic materials. In this overview, thermal intermetallic compounds are extensively described based mainly on our past works, since there had been less works in research field. Emphasis placed B2 and L12 with bonding such as NiAl, Ni3Al, etc., which have attracting attention engineering at higher temperatures. The data accumulated compounds, phenomenological aspects reviewed detail a function alloy composition, constituent temperature. Wiedemann-Franz law applicable to indicating that carrier conduction an electron rather than phonon. compound ordered crystal structure characterized enhancement due ordering reference basic contribution solid solution disordered structure. It demonstrated reduced by addition third element, subject also covered.