Tunable dielectric and other properties in high-performance sandwich-type polyimide films achieved by adjusting the porous structure

摘要: The preparation and performance adjustment of low-dielectric polyimide (PI) play important roles in the development application next-generation dielectric materials used high-speed integrated circuits. Herein, composite films with sandwich-type porous structures were fabricated via a microemulsion method, which self-assembly water droplets was involved. Decreases constant absorption increases tensile strength modulus simultaneously realized due to presence symmetrical dense PI layer upon introduction structure. dielectric, mechanical resistance properties could be further regulated by controlling structure using different conditions for film formation. By varying temperature, humidity, concentrations polymer surfactant we obtained low constants 2.24–2.81 absorptions 0.49–0.59%, decreases from 15.73% 32.81% 76.02% 80.08%, respectively, as compared case flat film; also achieved high strengths 97.7–103.2 MPa moduli 1.2–1.4 GPa, 4.83–10.73% 6.57–16.43%, film. Moreover, excellent durability under humidity condition demonstrated very small increase (0.02–1%) moist environment. These results provide useful information structural design high-performance materials.