A Kinetic Study of Biphenyl Type Epoxy-Xylok Resin System with Different Kinds of Catalysts

摘要: The investigation of cure kinetics biphenyl epoxy (4,4-diglycidyloxy-3,3,5,5-tetramethyl biphenyl)-xylok resin system with four different catalysts was performed by differential scanning calorimeter using an isothermal approach. All kinetic parameters the curing reaction including order, activation energy and rate constant were calculated reported. results indicate that formulations triphenylphosphine (TPP) 1-benzyl-2-methylimidazole (1B2MI) as a catalyst proceeds through first order mechanism, whereas diazabicyloundecene (DBU) tetraphenyl phosphonium borate (TPP-TPB) autocatalytic mechanism. To describe in latter stage, we have used semiempirical relationship proposed Chern Poehlein. By combining nth model or diffusion factor, it is possible to predict each catalytic over whole range conversion