Fabrication and adhesion performance of gold conductive patterns on silicon substrate by laser sintering
作者： Zhixiang Cai , K.C. Yung , Xiaoyan Zeng
DOI: 10.1016/J.APSUSC.2011.08.088
关键词:
摘要: Abstract Laser sintering of gold-microparticle ink was examined in this study. Laser-sintered gold conductive patterns were characterized by using scanning electron microscope (SEM), energy-dispersive spectrometer (EDS), cross-cut tape test and destructive bond wire pull tests. The effects laser power on microstructure adhesion investigated. It found that the became denser with increase power. treated 2 W showed poor adhesiveness 2B accordance ASTM D3359-08. level increased to 5B elevating 8 W. mechanism silicon substrate discussed bonding also performed patterns. Wire breakage took place at practical strength around 5 gf.
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