Brazing of graphite to Cu with Cu50TiH2 + C composite filler
作者： Yangwu Mao , Sheng Wang , Liangxing Peng , Quanrong Deng , Pei Zhao
DOI: 10.1007/S10853-015-9415-0
关键词:
摘要: Brazing of graphite to Cu has been successfully realized with Cu50TiH2 (containing 50 wt% Cu)-based fillers (including filler and + C composite filler) in vacuum at 1223 K. The average shear strength is 10.8 MPa for the joints brazed filler. Microstructure observation shows crack-free interfaces both sides. layer mainly consists base solid solution Ti–Cu intermetallics. Furthermore, a thin TiC reaction developed close substrate. With regard filler, increases 18.0 MPa. Microstructural characterization reveals that particles have synthesized situ layer. intermetallics together are detected distribute uniformly layer, which may act as reinforcements consequently benefit improvement graphite/Cu joints.
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