Conductive metal ball bonding with electrostatic discharge detection
作者： Jeerasak Potham , Pornchai Rakpongsiri
DOI:
关键词:
摘要: An apparatus for bonding a conductive lead to terminal of device by the use metal ball is disclosed. A ball-forming wire comprises first having melting temperature. clamping surface has closed position in contact with wire. wire-clamping actuator coupled and electrically connected signal source. sparking pin second temperature higher than The power current detection transformer includes magnetic core at least partially encircling analyzing circuit transformer.
lens.org 参考文章(59)
Kenneth Allen, Albert J. Wallash, Two-step electrical connector and method using high resistance path for electrostatic discharge ,(2003)
Frederick M. Persson, David C. Frankel, Method and apparatus to detect automatic wire bonder failure ,(1978)
Osamu Nakamura, Kazumasa Sasakura, Method for cleaning a bonding tool used on covered bonding wires ,(1996)
Larry D. Burkholder, William J. Gleeson, Bradley K. Benton, Owen E. Gibson, Bond signature analyzer ,(1989)
John A. Kurtz, Alan H. Plaisted, Bonding wire ball formation ,(1989)
Krishna Seshan, David C. Long, Ultrasonic adhesion/dehesion monitoring apparatus with power feedback measuring means ,(1992)
Masanao Ura, Naokazu Watanabe, Wire bonding misattachment detection apparatus and that detection method in a wire bonder ,(1992)
Richard G Friess, Constant-temperature-pulsed thermocompression ball bonder system ,(1969)
Yoshikatsu Hayashizaki, Katsuro Yanagida, Wire bonder with bonding arm angle sensor ,(1992)
Allan I. Dacanay, Enrique R. Ferrer, Raymond M. Partosa, Wire bond integrity test system ,(2004)