Microstructure characteristic and its influence on the strength of SiC ceramic joints diffusion bonded by spark plasma sintering
作者： H.X. Li , Z.H. Zhong , H.B. Zhang , Z.X. Zhu , P. Hua
DOI: 10.1016/J.CERAMINT.2017.11.185
关键词:
摘要: Abstract The interfacial microstructure evolution and shear strength of SiC joints for high temperature applications diffusion bonded by spark plasma sintering with a Ta-5W interlayer in the range 1500 °C to 1700 °C were investigated. analysis indicated that (Ta,W)C phase formed initially (Ta,W)-Si intermetallic compounds subsequently at SiC/Ta-5W interface. Bonding had significant effect on reaction layer thickness, which increased increasing bonding temperature, holding time also has an influence thickness. Calculation kinetics interface showed constant was about two orders magnitude larger than obtained hot-pressing bonding, activation energy almost one-tenth bonding. Both thickness defects great robustness joint, maximum 122 ± 15 MPa joint 1600 °C 5 min.
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