摘要: The planar antenna (PA) of a transponder chip module (TCM) may have U-shaped portion so that an outer end (OE) the be positioned close to RFID (IC) disposed at central area tape (MT) for module. A (MT 2 ) contact pads (CP) on one side thereof and connection bridge (CBR) another thereof, joined with 1 having (PA). Metal conductive layer (CL) within element such as coupling frame (CF) or scribed many small segments. metal sheet stamped metallization,
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