BGA brittle fracture - alternative solder joint integrity test methods
作者： K. Newman
DOI: 10.1109/ECTC.2005.1441422
关键词:
摘要: A solder ball shear and pull testing study was conducted on 27 unique package constructions, evaluated under a wide variety of test conditions. The encompassed the coordinated efforts 7 electronics manufacturers using early-prototype high speed shear/pull equipment. Shear speeds ranged from conventional 0.0001 m/s (100 /spl mu/m/s) rate up to as 4 m/s, while 0.0005 (500 1.3 m/s. many configurations varied in substrate plating type (exposed Cu, electrolytic NiAu electroless-Ni/immersion-Au), composition (SnPb, SnPbAg SnAgCu), packaging construction materials, geometries, assembly location, time between reflow test.
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