Modeling and experimental analysis of an internally-cooled vapor chamber
作者： Pengfei Bai , Huawei Wang , Ruipeng Cai , Xingliang Chen , Yuhao Luo
DOI: 10.1016/J.ENCONMAN.2021.114017
关键词:
摘要: Abstract In recent years, hotspots have become fatal obstacles that prevent chips from normal operation due to the ever-increasing heat flux of supercomputers. order reduce probability and extend lifetime chips, internally-cooled vapor chamber (ICVC) is designed fabricated improve temperature uniformity. Besides, mathematical numerical models ICVC are built, respectively. The featured with a co-designing liquid cooling chamber, which can provide more efficient thermal management under high flux. double-layered pipe embedded in where two transfer ways phase change single-phase coordinated. effects coolant flow rate on various parameters, including uniformity, response, resistance, pressure drop, experimentally studied. experimental simulation distribution drop compared. results show yield superior advantage terms minimum total resistance be decreased 0.044 K/W. Additionally, compared other related research, suitable promising for devices require low good uniformity
sci-hub.st 参考文章(37)
Yong Jiun Lee, Pawan K Singh, Poh Seng Lee, None, Fluid flow and heat transfer investigations on enhanced microchannel heat sink using oblique fins with parametric study International Journal of Heat and Mass Transfer. ,vol. 81, pp. 325- 336 ,(2015) , 10.1016/J.IJHEATMASSTRANSFER.2014.10.018
Myung Ki Sung, Issam Mudawar, CHF determination for high-heat flux phase change cooling system incorporating both micro-channel flow and jet impingement International Journal of Heat and Mass Transfer. ,vol. 52, pp. 610- 619 ,(2009) , 10.1016/J.IJHEATMASSTRANSFER.2008.07.035
Gongnan Xie, Jian Liu, Yanquan Liu, Bengt Sunden, Weihong Zhang, Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling Journal of Electronic Packaging. ,vol. 135, pp. 021008- ,(2013) , 10.1115/1.4023530
Daxiang Deng, Wei Wan, Haoran Shao, Yong Tang, Junyuan Feng, Jian Zeng, Effects of operation parameters on flow boiling characteristics of heat sink cooling systems with reentrant porous microchannels Energy Conversion and Management. ,vol. 96, pp. 340- 351 ,(2015) , 10.1016/J.ENCONMAN.2015.02.072
Stefan S. Bertsch, Eckhard A. Groll, Suresh V. Garimella, A composite heat transfer correlation for saturated flow boiling in small channels International Journal of Heat and Mass Transfer. ,vol. 52, pp. 2110- 2118 ,(2009) , 10.1016/J.IJHEATMASSTRANSFER.2008.10.022
Tianyi Gao, Milnes David, James Geer, Roger Schmidt, Bahgat Sammakia, Experimental and numerical dynamic investigation of an energy efficient liquid cooled chiller-less data center test facility Energy and Buildings. ,vol. 91, pp. 83- 96 ,(2015) , 10.1016/J.ENBUILD.2015.01.028
S. Sharples, P.S. Charlesworth, Full-scale measurements of wind-induced convective heat transfer from a roof-mounted flat plate solar collector Solar Energy. ,vol. 62, pp. 69- 77 ,(1998) , 10.1016/S0038-092X(97)00119-9
Meng-Chang Tsai, Shung-Wen Kang, Kleber Vieira de Paiva, Experimental studies of thermal resistance in a vapor chamber heat spreader Applied Thermal Engineering. ,vol. 56, pp. 38- 44 ,(2013) , 10.1016/J.APPLTHERMALENG.2013.02.034
Y. Sui, P.S. Lee, C.J. Teo, An experimental study of flow friction and heat transfer in wavy microchannels with rectangular cross section International Journal of Thermal Sciences. ,vol. 50, pp. 2473- 2482 ,(2011) , 10.1016/J.IJTHERMALSCI.2011.06.017
D.B. Tuckerman, R.F.W. Pease, High-performance heat sinking for VLSI IEEE Electron Device Letters. ,vol. 2, pp. 126- 129 ,(1981) , 10.1109/EDL.1981.25367