Mixed mode stress field effect in adhesive fracture

摘要: Numerical or analytical analyses were performed on seven different test specimens including blister test, 90-degree peel torsion and various cone tests. These are in general subjected to complex stress fields having amounts of Mode I, II, III loads. The then constructed using polymethylmethacrylate (PMMA) for the adherends a transparent polyurethane elastomer (Solithane® 113)1 adhesive. This combination permitted direct observation bondline as load was applied. Although initial debonds well bond end termination singularities present all specimens, some cases debond did not initiate at singularity points would normally have been expected. An explanation this behavior is presented, comparison loading mode effect those which propagate from terminus singular point. In addition, adhesive compressibility, thickness, geometric curvature discussed many specimens.