Low profile zero/low insertion force package top side flex cable connector architecture
作者： Sanka Gans Ganesan , Ram S. Viswanath
DOI:
关键词:
摘要: An integrated circuit package is presented. In an embodiment, the has contact pads formed on top side of a substrate, die electrically attached to pads, and input/output (I/O) substrate. The I/O are connected pads. also includes flex cable receptacle non-compressively attachable connector connection pins
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