Fabrication of indium bumps for hybrid infrared focal plane array applications
作者： Jutao Jiang , Stanley Tsao , Thomas O’Sullivan , Manijeh Razeghi , Gail J. Brown
DOI: 10.1016/J.INFRARED.2003.08.002
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摘要: Abstract Hybrid infrared focal plane arrays (FPAs) have found many applications. In hybrid IR FPAs, FPA and Si read out integrated circuits (ROICs) are bonded together with indium bumps by flip-chip bonding. Taller higher uniformity always being pursued in fabrication. this paper, two bump fabrication processes based on evaporation electroplating techniques developed. Issues related to each technique addressed detail. The is a unique positive lithography process. method achieves taller high aspect ratio “multi-stack” technique. This could potentially benefit the of multi-color FPAs. Finally, proposed low-cost technique, “bump transfer”, given as future technology for
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