Influence of the Substrate Orientation on the Isothermal Solidification during TLP Bonding Single Crystal Superalloys

作者: Naicheng Sheng , Bo Li , Jide Liu , Tao Jin , Xiaofeng Sun

DOI: 10.1016/J.JMST.2013.11.013

关键词:

摘要: … single crystal blades [3] . During the production of blades using TLP bonding, small single crystal … , and then the small segments are TLP bonded. The bonding zones are usually in the …

参考文章(19)
Gary W. Swartzbeck, Thomas Walter Zagar, Michael A. Burke, Mohan A. Hebbar, Paula D. Freyer, Brij B. Seth, Turbine blades made from multiple single crystal cast superalloy segments ,(1998)
K. Ikeuchi, Y. Zhou, H. Kokawa, T. H. North, Liquid-solid interface migration at grain boundary regions during transient liquid phase brazing Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science. ,vol. 23, pp. 2905- 2915 ,(1992) , 10.1007/BF02651768
K. Saida, Y. Zhou, T. H. North, The influence of base metal grain size on isothermal solidification during transient liquid-phase brazing of nickel Journal of Materials Science. ,vol. 28, pp. 6427- 6432 ,(1993) , 10.1007/BF01352207
W. F. Gale, Y. Guan, Transient liquid-phase bonding in the NiAl/Cu/Ni system -- A microstructural investigation Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science. ,vol. 27, pp. 3621- 3629 ,(1996) , 10.1007/BF02595453
W.F. Gale, D.A. Butts, Transient liquid phase bonding Science and Technology of Welding and Joining. ,vol. 9, pp. 283- 300 ,(2004) , 10.1179/136217104225021724
Isaac Tuah-Poku, M. Dollar, T.B. Massalski, A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science. ,vol. 19, pp. 675- 686 ,(1988) , 10.1007/BF02649282
H. Kokawa, C. H. Lee, T. H. North, Effect of grain boundaries on isothermal solidification during transient liquid phase brazing Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science. ,vol. 22, pp. 1627- 1631 ,(1991) , 10.1007/BF02667375
N. C. Sheng, J. D. Liu, T. Jin, X. F. Sun, Z. Q. Hu, Wide Gap TLP Bonding a Single-Crystal Superalloy: Evolution of the L/S Interface Morphology and Formation of the Isolated Grain Boundaries Metallurgical and Materials Transactions A. ,vol. 44, pp. 1793- 1804 ,(2013) , 10.1007/S11661-012-1540-7