Significantly improving mechanical, thermal and dielectric properties of cyanate ester resin through building a new crosslinked network with unique polysiloxane@polyimide core–shell microsphere

摘要: High-performance thermosetting resin (HPTR) has been a key fundamental material in many cutting-edge industrial fields. However, it is still challenge to develop an HPTR that simultaneously possesses higher heat resistance, toughness and rigidity. Herein, new soft-core hard-shell microsphere (PSi@PI) with active groups, composed of polysiloxane (PSi) as core polyimide (PI) shell, was designed synthesized. It excellent thermal stability, the initial decomposition temperature (Tdi) being high 447 °C. PSi@PI microspheres were embodied into cyanate ester (CE) prepare series PSi@PI/CE resins using melt-blending technique. The mechanical, dielectric properties systematically studied. results show have much better than CE resin. Typically, impact strength 2PSi@PI/CE (with 2 wt% PSi@PI) 28 kJ m−2, about 1.8 times resin; moreover, even storage modulus Note Tdi glass transition are 450 °C 300 °C, respectively, 4–14 Moreover, compared resin, lower constant loss. These attractive comprehensive demonstrate high-efficiency multi-functional filler, which great potential preparation HPTRs, especially those for fields demanding requirements terms outstanding integrated performances, including toughness, rigidity, properties.