Moulded parts made of polyamides which are free of dimeric acids
作者： Thomas Möller , Georg Schubert , Bettina Becker , Thomas Huver , Angela Rossini
DOI:
关键词:
摘要: The invention relates to polyamides based on reaction products from C4 - C18 dicarboxylic acids. According the invention, are suitable for use as moulding materials production of moulded parts using low pressure or injection methods in addition ensuring adhesive density filling during electrical electronic devices, particularly plugs, cables, switches, sensors, transponders, modules, circuit boards, smart cards. Compared with conventional mouldable known melt adhesives, inventive exhibit higher mechanical properties, abrasive-resistant properties and resistance various media.
lens.org 参考文章(20)
Roberto Leoni, Werner Gruber, Angela Rossini, Polyamide resin from dimer/trimer acid and N-alkyl diamine ,(1987)
Ulrike Maassen, Siegfried Kopannia, Reimar Heucher, Polyamide hotmelt adhesive ,(1997)
Roberto Leoni, Werner Gruber, Angela Rossini, Polyamide of dimerized fatty acids and polyether urea diamines and their use as adhesives ,(1988)
Norbert Wiemers, Italo Albini, Adhesive compositions based upon thermoplastic polyamides ,(1982)
Donald A. Van Beek, Polyamide of dimer acids, alkylene diamine and polyalkylene polyamine ,(1991)
Jerald K. Rasmussen, Impact resistant, thermoplastic polyamides ,(1978)
Werner Gruber, Juergen Wichelhaus, Johannes Andres, Polymeric hotmelt adhesive ,(1986)
Georg Schubert, Michael Krebs, Karin Jonscher, Roland Heider, Moldings of polyurethane hotmelt adhesives ,(1995)
Italo Albini, Norbert Wiemers, Roberto Leoni, Werner Gruber, Juergen Wichelhaus, Angela Rossini, Methods of making and using thermoplastic block copolymers ,(1990)
Bettina Becker, Angela Rossini, Reimar Heucher, Polyamide based on dimer fatty acid ,(1995)