Method and apparatus for surface treating of substrates

摘要: A method for surface treating of thin substrates such as semiconductor wafers, wherein a wafer formed with deep and minute trenches on its is horizontally placed spinner in chamber trenched directed up, then ultraviolet light emitted to the dissolve impurities sticking trenches, thereafter etchant spouted from nozzle being spinned about vertical axis at high speed, next inside rendered lower pressure than atmospheric recovered after lapse predetermined time, thus series these steps supplying, reducing, recovering are carried out until complete entrance into interior surfaces effected, so even or smooth surfaces, finally treated rinsing, heating drying.