作者: F. H. Streitz , R. C. Cammarata , K. Sieradzki
DOI: 10.1103/PHYSREVB.49.10699
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摘要: We present a detailed model describing the effects of surface stress on equilibrium spacing and biaxial modulus thin metal films. The predicts that very films will equilibrate to in plane substantially smaller than bulk for material, this strain vanish as reciprocal film thickness. enhancements which also scale with magnitude both resulting change are proportional stress. verified predictions surface-stress by performing molecular-dynamics computer simulations using an analytic form embedded-atom-method potential. was found predict accurately properties