High density, three-dimensional, intercoupled circuit structure

摘要: A three-dimensional circuit structure includes a plurality of elongate cylindrical substrates positioned in parallel and contact with one another. Electrical components are formed on the surfaces substrates, along electrical conductors coupled to those components. The selectively each substrate so as adjacent allow for transfer signals between substrates. conductor patterns may be helical, circumferential, or longitudinal, such fashion that added removed from bundle will continue operate needed. nature leaves gaps channels which cooling fluid supplied circuitry.