Mechanical and microstructural properties of SnAgCu solder joints
作者： Janne J. Sundelin , Sami T. Nurmi , Toivo K. Lepistö , Eero O. Ristolainen
DOI: 10.1016/J.MSEA.2006.01.065
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摘要: Abstract Mechanical and microstructural properties of SnAgCu solder joints with hypoeutectic, eutectic hypereutectic compositions were studied. Eutectic SnPb used as the reference. Reflowed lap shear specimens made FR-4 glass epoxy printed circuit boards OSP NiAu surface finishes in tests. features examined as-reflowed condition after isothermal aging at 85 °C for 1000 h. Both composition PCB finish had a notable effect on mechanical behaviour joints. The strength value was mainly dependent size distribution Ag3Sn dispersions. coarseness dispersions depends strongly amount Ag alloy, cooling rate reflow history
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