作者: Cell K. Y. Wong , S. Y. Y. Leung , R. H. Poelma , K. M. B. Jansen , C. C. A. Yuan
DOI: 10.1007/978-3-319-12862-7_7
关键词:
摘要: Polymer-metal interfacial adhesion is one of the most important phenomena in field science and technology [1, 2]. The has been widely applied, both structurally functionally, industries such as electronic packaging advanced composites. Prediction properties joint materials during their service life a concern product reliability [3, 4]. conventional method, which involves continuum fracture mechanics, requires analysis stresses well behind crack tip processing zone. As feature size products or filler composite approaches nanoscale, zone becomes dominant within analyzed structure. Thus, applicability mechanics problematic.