Chemistry in Interconnects

Dielectric Films for Advanced Microelectronics John Wiley & Sons. ,(2007) , 10.1002/9780470017944

Mikhail Baklanov, Paul S Ho, Ehrenfried Zschech, None, Advanced Interconnects for ULSI Technology John Wiley and Sons. ,(2012) , 10.1002/9781119963677

Yuzhuo Li, Microelectronic Applications of Chemical Mechanical Planarization John Wiley & Sons, Inc.. ,(2007) , 10.1002/9780470180907

A Baldacci, C Rivero, P Gergaud, M Grégoire, O Sicardy, O Bostrom, P Boivin, JS Micha, O Thomas, None, Stresses in copper blanket films and damascene lines : measurements and finite element analysis european solid state circuits conference. pp. 105- 108 ,(2004) , 10.1109/ESSDER.2004.1356499

B.U. Yoo, S. Kondo, S. Tokitoh, A. Namiki, K. Misawa, K. Inukai, N. Ohashi, N. Kobayashi, Characterization of patterned low-k film delamination during CMP for the 32nm node Cu/ultra low-k (k=1.6-1.8) integration international interconnect technology conference. pp. 239- 241 ,(2004) , 10.1109/IITC.2004.1345761

Michael Morgen, E. Todd Ryan, Jie-Hua Zhao, Chuan Hu, Taiheui Cho, Paul S. Ho, Low Dielectric Constant Materials for ULSI Interconnects Annual Review of Materials Science. ,vol. 30, pp. 645- 680 ,(2000) , 10.1146/ANNUREV.MATSCI.30.1.645

Morand, Lerme, Palleau, Torres, Vinet, Demolliens, Ulmer, Gobil, Fayolle, Romagna, Le Bihan, Copper Integration In Self Aligned Dual Damascene Architecture symposium on vlsi technology. pp. 31- 32 ,(1997) , 10.1109/VLSIT.1997.623680

J.F. Guillaumond, L. Arnaud, T. Mourier, M. Fayolle, O. Pesci, G. Reimbold, Analysis of resistivity in nano-interconnect: full range (4.2-300 K) temperature characterization international interconnect technology conference. pp. 132- 134 ,(2003) , 10.1109/IITC.2003.1219733

Jeffrey M. Lauerhaas, Alan D. Rose, Jimmy D. Collins, Tracy A. Gast, Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation ,(2009)

F. Iacopi, Y. Travaly, B. Eyckens, C. Waldfried, T. Abell, E. P. Guyer, D. M. Gage, R. H. Dauskardt, T. Sajavaara, K. Houthoofd, P. Grobet, P. Jacobs, K. Maex, Short-ranged structural rearrangement and enhancement of mechanical properties of organosilicate glasses induced by ultraviolet radiation Journal of Applied Physics. ,vol. 99, pp. 053511- ,(2006) , 10.1063/1.2178393