Method of aligning and attaching circuit devices on a substrate

摘要: Method for aligning and supporting micro-circuit devices on substrate conductors during attachment thereto in which shaped, flexible, insulative material is placed between the their respective to support heat fusible terminals of alignment with mating heat-fusible conductor lands formation fused connections. The can be selected thickness non-attached either contact or out lands. When circuit are held lands, material, being plastic character, softens heating allow joining connections and, upon cooling, returns a thicker state elongate