Electronic apparatus enclosure device and electronic apparatus cooling system
作者： Akira Shoujiguchi , Kenichi Inaba , Arihiro Matsunaga , Masaki Chiba , Minoru Yoshikawa
DOI:
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摘要: A vapor pipe 103 connects a heat dissipation portion 200 and each of plurality receiving portions 102. liquid 104 the bypass 105 104. valve 106 opens closes flow path 105. first connection 107 second 108 The is disposed at position higher than that 108. As result, refrigerant can be efficiently transported in short time.
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